See the complete picture of process technology and performance
Our reports explain the use of technology implementation in electronic circuits, software and manufacturing processes. They are used to gain intelligence about technology innovations and find evidence of use, proving patent value to technology, legal and patent professionals.
Our Transistor and Characterization analysis allow you to:
- See the complete picture of process technology and performance
- Understand the process, see the performance, spot the trends
- Universal curves for IOFF vs. ION and IOFF vs. ID, LIN; transfer and output characteristics for each universal curve data point
TechInsights’ transistor characteristics report provides analysis on the DC electrical properties of the logic NMOS and PMOS transistors
The report includes graphs and tabulated measurements of key performance benchmarks measured at -20, 25 °C, and 80 °C. 25 °C single temperature reports are also available.
Specific DC Analysis Benchmarks of the NMOS and PMOS transistors include:
- Linear (VT,LIN) and saturated (VT,SAT)threshold voltages
- Drive Current (ID,SAT)
- Off-state current (IOFF) and gate leakage current (IG)
- Sub-threshold swing (S)
- Transconductance (gm)
- Punch-through voltage (VPT)
- Process gain factor (k)
- IDS vs. VGS graphs
- IDS vs. VDS graphs
Supporting data includes:
- Package photographs and package X-ray
- Die photograph and die markings
- SEM topographical images of the measured NMOS and PMOS transistors
- TEM cross-sectional images showing the NMOS and PMOS gate lengths
TIPS Webinar: Techniques to Analyze NAND Flash and SSD Devices - Internal Probing, Waveform Analysis, and More
This presentation examines some of the areas of innovation in NAND Flash and SSD devices and provides an overview of the various testing methods we apply to analyze these innovations.
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Recent News and Blogs

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Semiconductor Sales Turned Up
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Google Builds Video-Transcoder Chip
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Loihi 2 Advances Spiking R&D
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Semiconductor sales took a deep post-September dive last week
Comments, Questions & Answers: IBM's Telum processor. DRAM Contract vs Spot Prices. Downturn Warning Signs. Excessive CapEx Exuberance.
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Applied Materials Unveils eBeam Metrology System that Enables a New Playbook for Patterning Advanced Logic and Memory Chips
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TechInsights Acquires The Linley Group to Further Expand Its Platform of Semiconductor Content
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Power and Compound Fab Capacity Projected to Top Record 10 Million Wafers Per Month in 2023, SEMI Reports
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Anton 3 Cracks Molecular Dynamics
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Cadence Takes Tensilica AI to the Max
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Samsung Demos In-Memory Processing
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The Industry Is Soaring but Carries a Tether of Caution
Equipment suppliers continue to see a very strong level of activity which is why they expect 2022 to be another solid year for them.
The Industry Is Soaring but Carries a Tether of Caution
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Downturn Warning Signs. Excessive CapEx Exuberance
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Semiconductor Market on Track to Hit $0.6t in 2021
The positive sign that electronic prices are turning up, Wafer prices are 40% higher than a year ago, August WSTS was really strong, and Power Semiconductors.
Semiconductor Sales Closing in on a Record $600m Year
Semiconductor sales closed in on $12B, another all-time weekly record. Semiconductor Sales are closing in on a record $600M in 2021 with 24% growth.
IBM’s Telum processor. Aart deGeus on EDA-AI.
IBM is a powerhouse in AI, as it has always been a powerhouse in semiconductor research. But this is often in the shadow of west-coast technology giants who dominate west-centric conferences.
Semiconductor Industry Strategic Trends
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YMTC 128L 3D Xtacking 2.0 TLC NAND
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Apple iPhone 13 Pro Teardown
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TSMC's Gift to the Industry
This week Andrea Lati, Dan Hutcheson, Jason Abt, and Risto Puhakka discuss what insiders are saying about: TSMC’s gift to the industry, 2021 forecast updates: Few notable changes, 2022 the big question of much higher growth, and the next big thing in image sensors.
Whitepaper - Software is Critical to Edge-AI Deployment
This white paper describes the importance of a flexible and robust software stack to edge-AI deployment. Processor vendors and intellectual-property licensers often tout the theoretical performance of their designs, but the neural-network compiler, run-time engine, and scheduler are just as critical to realizing that potential in production systems. The Linley Group prepared this paper, which EdgeCortix sponsored, but the opinions and analysis are those of the author.
Europe's Semiconductor Share Loss and Most Advanced Memory Maker
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Fitbit Luxe Teardown
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Semiconductor Communications Market Share and Forecast
Provides five-year revenue forecasts for many categories of communications semiconductors, including Ethernet products, smart NICs, embedded and server processors, and FPGAs.
Disruptive Technology: TSMC 22ULL eMRAM
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Innovation Decisions Accelerated: TechInsights Acquires VLSIresearch TechInsights is pleased to announce the acquisition of VLSI Research Inc., the award-winning provider of market research and economic analysis covering the semiconductor supply
Micron 176L 3D NAND
NAND Memory Technology Micron B47R 3D CTF CuA NAND Die, the World’s First 176L (195T)! Micron’s 176L 3D NAND is the world’s first 176L 3D NAND Flash memory. TechInsights just found the 512Gb 176L die (B47R die markings) and quickly viewed its process
Latest SJ-MOSFET Technology, Can It Still Compete with Wide Bandgap?
Power Semiconductor Technology Latest SJ-MOSFET Technology, Can It Still Compete with Wide Bandgap? Now both silicon carbide (SiC) and gallium nitride (GaN) products are having an impact in the marketplace, it is easy to think that there is no longer
The Auto Shortage Is a Riddle, Wrapped in a Mystery, Inside an Enigma
This week Andrea Lati, Dan Hutcheson, John West, and Risto Puhakka discuss what insiders are saying about the Auto IC shortage and how the 4Q21 Forecast is shaping up.
Advanced Micro-Fabrication Equipment Inc. China earns its second triple crown
Provides state-of-the-art equipment, process knowhow, and all-star support to customers in front-end semiconductor manufacturing, back-end wafer level packaging, LED production, MEMS applications, and other semiconductor fabrication processes.
Micron DDR5 DIMM Technology
DRAM Memory Technology Disruptive Product: What technology node for 1st DDR5 DIMM? DDR5 is a new generation of Memory! All the major DRAM players are moving forward to a faster DRAM, DDR5. DDR5 improves power management (1.1V vs. 1.2V for DDR4) as
ASML awarded five stars across all of its categories
As the leading lithography innovator in the chip industry, ASML’s solutions in lithography and process control have been making it possible for chip makers progress in better and faster devices.
ASM Pacific Technology secures its fifth triple crown
ASM Pacific Technology, the world leader in the supply of semiconductor assembly and packaging equipment, awarded 4 VLSI Stars with a solid 8.47.
Micron 1α DRAM Technology
DRAM Memory Technology Micron D1α, '14 nm'! The Most Advanced Node Ever on DRAM! D1α! It’s 14 nm! After a quick view on Micron D1α die (die markings: Z41C) and cell design, it’s the most advanced technology node ever on DRAM. Further, it’s the first
EUV光刻机争夺战,升级!(EUV lithography machine battle, upgrade!)
The battle for EUV lithography machines is gradually intensifying.
Memory Technology Highlights from TechInsights 2021 Webinar
Due to strong and growing demands for memory chips from storage, mobile, and AIOT market, all the memory players are striving to increase density/performance, reduce manufacturing cost, and develop the new and innovative technologies for each generation.
How many mini-LEDs did Apple pack into the iPad Pro?
Teardown Technology Stacy Wegner How many mini-LEDs did Apple pack into the iPad Pro? An in-depth look at the Liquid Retina XDR display Note: this article provides an update to the Displays section of our lengthier article on the TechInsights
Electric Vehicle Technologies Webinar: An in-depth analysis from the market to the semiconductor
This webinar will be jointly delivered by Strategy Analytics, Munro & Associates, and TechInsights. Each organization brings a wealth of knowledge to the discussion, with Strategy Analytics covering market information, Munro & Associates covering electronic systems, schematics, components, and mechanical structures, and TechInsights analyzing components at the semiconductor level.
Intel 2nd Generation XPoint Memory
Embedded and Emerging Memory Technology Here, we have the Intel 2nd gen. XPoint Memory die! Finally, we’ve found the Intel XPointTM Memory 2nd generation die! We’ve quickly viewed the die removed from Intel OptaneTM SSD DC P5800X 400GB (Model
Teardown: Apple iPhone 12 Pro Max 5G
Electronics360 News Desk: The following is a partial deep dive into a Teardown of the Apple iPhone 12 Pro Max 5G smartphone conducted by TechInsights.
Apple iPad Pro Teardown
In this year’s iPad Pro, the new 12.9” mini-LED display and new TrueDepth camera system may be taking ‘Center Stage’ for many users, TechInsights will continue to look deeper for other semiconductor and design winners inside the new iPad Pro.
Groundbreaking SenSWIR Sensor by Sony- IMX990/IMX991
This approach presents two advantages, the Cu-Cu DBI can help reduce the overall height of the Die while Die-to-Wafer hybridization can help reduce the per-Die cost, thereby facilitating greater utilization of Sony’s SWIR technology for a wide range of applications. Recently, TechInsights revealed the first detailed cross-sectional image of the 1.34MP.
Webinar: The Power Revolution - Innovation and IP in Power Management Technologies
The panel will discuss the making of power devices using semiconductors, power management technologies and products that use power efficiently, and the enforcement of the intellectual property rights associated with semiconductors and power management technologies.
Apple Homepod Mini Teardown
May 5, 2021 Teardown Technology A quick look inside the Apple Homepod Mini design wins, but is there a secret part waiting to be intialized? The Apple HomePod Mini A2374 is a voice-interactive smart speaker with Siri assistant. It features four
Guide to Processors for Deep Learning
Provides market share data for many categories of communications semiconductors, including Ethernet products, processors, and FPGAs.
Intel's 2nd Generation XPoint Memory
April 30, 2021 Dr. Jeongdong Choe Intel's 2nd Generation XPoint Memory - Will it be worth the long wait ahead? In 2017, TechInsights analyzed the details on Intel 1st gen. XPoint Memory (OptaneTM Memory 16GB, MEMPEK1W016GA) including structure
Qualcomm extends their mmWave leadership position
April 21, 2021 Kyle Nolan Qualcomm extends their mmWave leadership position 5G mmWave is still far from worldwide adoption but Qualcomm is keeping their foot on the pedal despite no one really close on their tail. One of Qualcomm’s Sr. Directors of
Samsung D1z LPDDR5 DRAM with EUV Lithography (EUVL) - Memory Blog
April 16, 2021 Dr. Jeongdong Choe Originally published in Samsung D1z LPDDR5 DRAM with EUV Lithography (EUVL) Finally! After months of waiting, we have seen Samsung Electronics’ applied extreme ultraviolet (EUV) lithography technology for D1z DRAM in
World’s First 1 Gb 28 nm STT-MRAM Product - by Everspin
March 30, 2021 Embedded & Emerging Memory World’s First 1 Gb 28 nm STT-MRAM Product - by Everspin Everspin’s new 1-Gigabit (Gb) Spin Torque Transfer Magneto-resistive Random Access Memory (STT-MRAM) device with a 28 nm process is the world’s first 1
TechInsights identifies some of Blackberry’s highest value patent assets through portfolio analysis
March 23, 2021 Abdullah Rahal TechInsights identifies some of Blackberry’s highest value patent assets through portfolio analysis Download the Summary of Analysis TechInsights’ analysts have examined the Blackberry patent portfolio and partitioned it
KIOXIA’s new XL-FLASH for ultra-low latency NAND application
March 23, 2021 Dr. Jeongdong Choe KIOXIA’s new XL-FLASH for ultra-low latency NAND application We’ve just found a new XL-FLASH product with 96L BiCS4 NAND cell architecture from KIOXIA. According to KIOXIA, XL-FLASH is extremely low-latency, high
Dynamic Vision Sensors – A Brief Overview - Image Sensor TechStream Blog
Dynamic Vison Sensors are Asynchronous imagers. Much like the human eye, they are designed to respond to changes in brightness, with no “Frames” to capture
Advanced 1 Gb 28 nm STT-MRAM products from Everspin Technologies
March 16, 2021 Dr. Jeongdong Choe Advanced 1 Gb 28 nm STT-MRAM products from Everspin Technologies We’ve been waiting for a long time to see the technology details of Everspin’s new stand-alone 1-Gigabit (Gb) Spin Torque Transfer Magneto-resistive
A New and advanced ReRAM from Fujitsu
March 9, 2021 Dr. Jeongdong Choe A New and advanced ReRAM from Fujitsu We’ve been analyzing a new ReRAM product from Fujitsu Semiconductor. Fujitsu 8 Mb MB85AS8MT is the world’s largest density as a stand-alone mass-produced ReRAM product. The
GaN USB-C Charger Market Heating Up in 2021
March 10, 2021 Sinjin Dixon-Warren Power Technology GaN USB-C Charger Market Heating Up in 2021 Gallium nitride (GaN) based high power USB chargers for smartphones, tablets and laptops is a growing area in the power electronics market. TechInsights
Prospects for Commercial High Voltage Silicon Carbide Devices - a Summary
March 03, 2021 Dr Peter Gammon Power Technology Prospects for Commercial High Voltage Silicon Carbide Devices - a Summary SiC power devices have the potential to reach voltage ratings beyond 30 kV, yet today, SiC chip manufacturers are focussed on
Webinar: Selected Imager and Sensor Trends and Comparisons
The intent of this webinar is to share selected content from our 2020 Image Sensor Device Essentials (DEF) subscription annual presentation.
Moore’s Law: Dead or Alive
Moore's Law: is it Dead or Alive? It’s a perennial subject that has come back in 2021. Without the chip industry you would not have a smartphone or a notebook computer at your side … no Facebook or Google either … only a slide rule, a pen, and paper
LiDAR 101 – Solid-State and Mechanical LiDARs
February 19, 2021 Automotive Technology LiDAR 101 – Solid-State and Mechanical LiDARs 2020 has been an exciting year for LiDAR manufacturers. Five LiDAR companies (Velodyne Inc, Luminar Technologies Inc, Innoviz Technologies Ltd, Aeva Inc, and Ouster
Webinar: Gearing Up for the Electric Vehicle (EV) Revolution
In this seminar we will discuss the major players, their technology choices and how they tie into the strict reliability standards required by the automotive industry.
Qualcomm Snapdragon 888 in the Xiaomi Mi 11 brings a new 5 nm entrant to market
February 03, 2021 Logic Disruptive Technology Download the brief Qualcomm Snapdragon 888 in the Xiaomi Mi 11 brings a new 5 nm entrant to market With their release of the Snapdragon 888, Qualcomm finds itself in competition with other 5 nm offerings
A Guide to Processors for Deep Learning
Covers processors for accelerating deep learning, neural networks, and vision processing for AI training and inference in data centers, autonomous vehicles, and client devices.
Supporting IP strategy in the semiconductor industry
Supporting IP strategy in the semiconductor industry Growing complexity of the chip market has made it harder than ever for intellectual property owners to monitor developments, making reverse engineering a crucial process The breadth of reverse
Analysts’ Choice Winners for 2020
The Linley Group recognizes 2020’s top products in the categories of data center, PC, embedded, mobile, networking, processor IP, and related technology. And the winners are…
Sony d-ToF Sensor found in Apple’s new LiDAR camera
January 19, 2021 Image Sensor Disruptive Technology Sony d-ToF Sensor found in Apple’s new LiDAR camera Apple’s LiDAR camera was first observed in 2020’s iPad Pro; as expected, we saw that same part used in the iPhone 12 Pro in October. Industry
2021 Forecast ... with Andrea Lati
2020 was a tumultuous year. Semiconductors decoupled from the macroeconomy and semiconductor production equipment demand boomed.
Webinar: Increasing Value of Semiconductor IP in the Automotive Supply Chain
Today, automobiles are more than just transportation devices. Automobiles are hotspots with entertainment systems, state of the art communications capabilities, and cutting edge displays that do far more than navigation.
2020 Semiconductor Mask Maker’s Survey ... a conversation with Aki Fujimura of the eBeam Initiative
Aki Fujimura discusses what the eBeam Initiative found in its 2020 Mask making survey. Every year, they run two surveys of mask makers and its luminaries.
Teardown: Velodyne Lidar Puck VLP-16 sensor (Electronics360)
A deep dive into the major components used in the light detection and ranging technology. Posted in Electronics360.
Webinar: Emerging GaN Technology in USB-C Power Delivery Adapters
In this presentation we will survey the different GaN integration strategies that we have observed in recently procured USB adapters. It is believed that GaN brings compelling advantages in terms of efficiency for adapter and other power supply products; however, achieving these efficiencies in a cost-effective manner can be challenging.
3D flash memory, 176 layers!
So far, NAND Flash has shown a white-hot stage. Not long ago, storage vendors were still "seeing the scenery on the high platform of flash memory" with 128 layers.
Webinar: Memory Technology 2020 and Beyond - NAND, DRAM, Emerging and Embedded Memory Technology Trends
Memory Technology 2020 and Beyond NAND, DRAM, Emerging and Embedded Memory Technology Trends This webinar was presented by TechInsights In this webinar, Dr. Jeongdong Choe will present his detailed review of the latest NAND, DRAM, emerging and
Webinar: An Examination of the Technical and Financial Implications of the Apple iPhone 12
The information presented in this webinar will be of greatest interest to those looking to understand the semiconductor design wins of the iPhone 12, and related financial implications to companies like Qualcomm, Broadcom, Skyworks, Qorvo, Cirrus Logic, Dialog Semiconductor, and more.
Micro Loading And Its Impact On Device Performance
How SEMulator3D can be used to study micro loading and manufacturing variability in an advanced DRAM process that exhibits a wiggling AA profile.
Webinar: ALD/ALE Process in Commercially Available Memory Devices
This presentation will examine some of the different structures we have seen through the evolution of these technologies, in particular the latest 3D-NAND and DRAM parts. We will also look at several historical applications of ALD/ALE technology that have been observed through reverse engineering.
iPhone Camera History: iPhone 12's Alternative and Normal
The evolutionary history of the iPhone camera can also be seen as the history of the development of the phone CIS, even if the iPhone does not fully follow the CIS technology trends to advance. Just take this opportunity, but also through the last
Webinar: Space, Power, BEAMs – Shorten the trek to gain the edge in 5G transceiver design and manufacturing
During this 30-minute presentation our experts will provide exclusive insight of our findings on the latest 5G mmWave transceiver architecture with a focus on the solution, including the QTM052 Antenna module from Qualcomm.
SK hynix 128L 3D PUC NAND (4D NAND)
SK hynix has released the world’s first 128-layer (128L) 3D NAND, which they have termed 4D NAND. This is their second NAND generation built using Periphery Under Cell (PUC) architecture; the first was their 96L NAND. In PUC architecture, peripheral
Webinar: ALD/ALE Process in Commercially Available Logic Devices
This presentation on the Atomic Layer Deposition/Atomic Layer Etching (ALD/ALE) process examines some of the different structures we have seen during the evolution of these logic technologies, in particular the latest 7 nm and 10 nm devices.
60 years of the Semiconductor industry and its changing patent strategy
Contributed by: Arabinda Das Today the semiconductor industry is a behemoth whose annual sales revenue crosses US $400 Billion. Over its 60 years of existence, this mature industry has experimented with various models like integrated device
Memory Process Webinar: 3D NAND Word Line Pad (WLP)
In this webinar, we present a comparison of 9x-layer 3D NAND devices from major manufacturers: Samsung, KIOXIA / Western Digital, Intel / Micron and SK hynix. The process sequence is discussed, with emphasis on the word line pad (WLP), also commonly known as staircase.
On Demand Webinar: A Review of the Power Device Ecosystem & IP Landscape for GaN
This webinar will be a review of the 650 V power MOSFET ecosystem and IP landscape. We will discuss the technologies in light of an early seminal GaN HEMT patent, demonstrating how reverse engineering can show innovation.
Apple iPhone 11 Pro Teardowns Look Encouraging for STMicro and Sony
STMicroelectronics and Sony each appear to be supplying four chips for Apple's latest flagship iPhones. Many other historical iPhone suppliers also make appearances in the latest teardowns.
Tesla Poised to Apply Maxwell’s Dry Electrode Innovation to Battery Cell Fabrication
Posted: February 7, 2019 Contributing Authors: Marty Bijman and Jim Hines Figure 1 – Tesla's portfolio including Maxwell and SolarCity acquisitions Figure 2 – Tesla Portfolio landscapes showing which inventions originated from Tesla, SolarCity, and
Creating Better Applications Through Patent Strengthening
Patent strengthening is the term we use to refer to the process of achieving the greatest potential for value from a patent during the prosecution – before a patent is even granted.
What does Uber’s patent landscape look like?
Posted: February 27, 2018 Contributing Authors: Marty Bijman Recently, IAM’s Timothy Au posted a blog providing a look at Uber’s portfolio. The blog references Uber’s portfolio makeup, and provides a chronicle of their IP events over the last 5 years
A Guide to Multicore Processors
Covers 32- and 64-bit embedded processors with four or more CPU cores that are used for wires and wireless communications, storage, security, and other applications.
A Guide to Ethernet Switch and PHY Chips
Covers data-center switch chips for 10G, 25G, 40G, 50G, and 100G Ethernet. Also includes physical-layer (PHY) chips for 10GBase-T and 100G Ethernet.
A Guide to Processors for IoT and Wearables
Covers processors and connectivity chips for IoT clients and wearable devices, focusing primarily on single-chip solutions with integrated radios.