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168飞艇开奖网官方网站-168开奖网 Latest Report Analysis

This report presents a Memory Floorplan Analysis of the SK Hynix H54MTD63M 12Gb 1y LPDDR4X die found inside the Apple iPhone 13 Pro smartphone.
This report presents a Memory Floorplan Analysis of the GigaDevice LONDON_4G die found inside the GD5F4GM5UFYIG component.
A Deep Dive report is a detailed product disassembly analysis that examines the latest personal electronics and provides unique construction, benchmarking, and cost data in a highly-digestible and graphics-rich format. The products are torn down using proprietary methods developed at TechInsights to provide a disassembly report with a multi-disciplinary "system view."
Survey Plus Reports include:
  • Device Observations
  • Analysis Summary
  • Major IC Manufacturer Distribution
  • RF Block Diagrams
  • Main Enclosure material information
  • Identify primary ICs and RF Modules such as SAW filters and Duplexers
  • ICs and RF Modules categorized by Component Functions
  • Provide package and die-size parameters
  • Selected die photos
  • Information on major sub-assemblies such as cameras and display/touchscreen subsystems
  • Price estimates for the ICs and RF Modules
This report presents a Basic Floorplan Analysis of the Samsung PHOBOS mmWave transceiver found inside the Samsung SFG-D0100 5G home router.
A Deep Dive report is a detailed product disassembly analysis that examines the latest personal electronics and provides unique construction, benchmarking, and cost data in a highly-digestible and graphics-rich format. The products are torn down using proprietary methods developed at TechInsights to provide a disassembly report with a multi-disciplinary "system view."
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